深圳會展中心（福田）
2025年8月26日-28日
| 主席：芯和半導(dǎo)體科技（上海）股份有限公司 創(chuàng)始人&總裁 代文亮 Chairman: Wenliang Dai,Founder and President, Xpeedic Co.,Ltd | ||
| 09:30-09:50 | 簽到及入場 Registration and Networking | |
| 09:50-10:00 | 致辭 Welcome | 中國半導(dǎo)體行業(yè)協(xié)會 副秘書長兼封測分會秘書長 徐冬梅 Dongmei Xu, Deputy Secretary-General and Secretary-General of the Closed Testing Branch, China Semiconductor Industry Association |
| 10:00-10:25 | 高算力AI應(yīng)用下，異構(gòu)集成系統(tǒng)的機(jī)遇與挑戰(zhàn) Heterogeneous Integration Systems for High-Computational AI Applications | 芯和半導(dǎo)體科技（上海）股份有限公司 創(chuàng)始人&總裁 代文亮 Wenliang Dai, Founder and President, Xpeedic Co., Ltd. |
| 10:25-10:50 | UCIe 2.0：推動開放芯粒生態(tài)的演進(jìn)和創(chuàng)新 UCIe 2.0: Driving the evolution and innovation of an open core ecosystem | 阿里云智能集團(tuán) 首席云服務(wù)器架構(gòu)師和研發(fā)總監(jiān)，CXL和UCle董事會成員 陳健 Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIeTM |
| 10:50-11:15 | 通向個(gè)人大模型之路 The Road to Personal Large Models | 上海燧原科技股份有限公司 首席芯片戰(zhàn)略官 周強(qiáng) Alex Zhou，Chief Chip Strategy Officer，Shanghai Enflame Technology Co., Ltd |
| 11:15-11:40 | 利揚(yáng)芯片一體兩翼戰(zhàn)略服務(wù)產(chǎn)業(yè)發(fā)展 Liyang chip integrated two wings strategic service industry development | 廣東利揚(yáng)芯片測試股份有限公司 總經(jīng)理 張亦鋒 Yeefeng Zhang, General Manager, Guangdong Liyang Chip Testing Co., Ltd, President, Dongguan Integrated Circuit Industry Association |
| 11:40-12:05 | 異質(zhì)整合的創(chuàng)新與發(fā)展 Packaging Innovation & Future by Heterogeneous Integration | 日月光半導(dǎo)體制造股份有限公司 資深副總 陳光雄 Scott Chen, Sr. Vice President, ASE Technology holding Co.Ltd |
| 12:05-12:30 | 全球及中國半導(dǎo)體市場數(shù)據(jù)解讀 Interpretation of Global and Chinese Semiconductor Market Data | SEMI 半導(dǎo)體事業(yè)發(fā)展部總監(jiān) 顧文昕 Wenxin Gu, Director of Semiconductor Business Development, SEMI |
| 12:30-13:30 | 午休及展區(qū)參觀 Lunch Break & SiP Zone | |
| 聯(lián)席主席：阿里云智能集團(tuán) 首席云服務(wù)器架構(gòu)師和研發(fā)總監(jiān)，CXL和UCle董事會成員 陳健 Co-Chairman:Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIe | ||
| 13:30-13:55 | 異構(gòu)集成技術(shù)的發(fā)展與挑戰(zhàn) The Development and Challenges of Heterogeneous Integration | 紫光展銳（上海）科技有限公司 封裝設(shè)計(jì)部負(fù)責(zé)人 仇元紅 William Qiu， Director， Unisoc (Shanghai) Technologies Co., Ltd |
| 13:55-14:20 | Chiplet系統(tǒng)SiP、UCIe和3DIC技術(shù)的集成革新探索 Innovative Exploration of Integrated Solution of Chiplet System SiP, UCIe and 3DIC technology | 新思科技 IP科技高級總監(jiān) 王迎春博士 Dr. Wang Yingchun, Senior Director of IP Technologies, Synopsys |
| 14:20-14:45 | 芯原Chiplet技術(shù)助力設(shè)計(jì)自動駕駛和高性能計(jì)算解決方案 VeriSilicon's Chiplet Technologies Empower Autonomous Driving and High-performance Computing Solutions | 芯原股份 芯片平臺事業(yè)部封裝工程副總裁 陳銀龍 Yinlong Chen, Vice President of Packaging Engineering of the Chip Platform Division, VeriSilicon Microelectronics (Shanghai) Co., Ltd |
| 14:45-15:10 | 3DIC多物理場挑戰(zhàn)及應(yīng)對策略 3DIC multi-physics challenges and coping strategies | 安似科技（上海）有限公司 Ansys 半導(dǎo)體事業(yè)部技術(shù)支持總監(jiān) 張書強(qiáng) Shuqiang Zhang, Ansys China Semiconductor BU ACE Director, ANSYS |
| 15:10-15:35 | 突破解決2.5D/3D Chiplet設(shè)計(jì)與驗(yàn)證中的一些關(guān)鍵問題 Breakthrough solves some key problems in the design and verification of 2.5D/3D chiplets | 深圳市比昂芯科技有限公司 市場總監(jiān) 趙瑜斌 Yubin Zhao, Marketing Director, BTD Technology |
| 15:35-16:00 | 走向高性能芯片的必經(jīng)之路，Chiplet與Die2Die接口 Chiplet & D2D IP, the road to achieve high performance chip | 奇異摩爾（上海）集成電路設(shè)計(jì)有限公司 銷售副總裁 馬巍 Eric Ma, Sales VP, kiwimoore |
| 16:00-16:25 | EDA使能大算力Chiplet集成系統(tǒng)高速互連接口信號完整性設(shè)計(jì) EDA Enables Signal Integrity Design for High Speed Interconnects of HPC Chiplet Systems | 芯和半導(dǎo)體科技（上海）股份有限公司 技術(shù)市場總監(jiān) 黃曉波 Xiaobo Huang, Director of Technical Marketing, Xpeedic Co., Ltd |
| 分論壇主席：奇異摩爾（上海）集成電路設(shè)計(jì)有限公司 產(chǎn)品與解決方案副總裁 ?？| Session Chairman: Jundong Zhu, Product and Solution VP, Kiwimoore (Shanghai) IC Co., Ltd | ||
| 09:30-10:00 | 簽到及入場 Registration and Networking | |
| 10:00-10:25 | 異構(gòu)系統(tǒng)集成實(shí)現(xiàn)——OSAT任重道遠(yuǎn) Implementation of heterogeneous system integration —— OSAT is a long way to go | 長電科技 高級專家 鄔建勇 Jianyong Wu, Senior Expert, JCET |
| 10:25-10:50 | UCIe+NoC——AI芯片Die-to-Die互連方案實(shí)現(xiàn) UCIe+NoC——The Die-to-Die Interconnection Solution for AI Chips | 上海晟聯(lián)科半導(dǎo)體有限公司 高級市場總監(jiān) 汪成喜 Chengxi Wang, Senior Marketing Director, Shanghai eTopus Technology Co., Ltd |
| 10:50-11:15 | Chiplet芯片技術(shù)在封裝級的相關(guān)應(yīng)用 Related applications of Chiplet chip technology in package level | 蘇州銳杰微科技集團(tuán)有限公司 董事長 方家恩 Jiaen Fang, Chairman, Suzhou Rigger Micro Technologies Group Co., Ltd |
| 11:15-11:40 | 熱仿真技術(shù)革新：為前沿電子產(chǎn)品熱設(shè)計(jì)加速賦能 Innovations in Thermal Simulation Technology: Accelerating and Empowering the Thermal Design of Cutting-edge Electronic Products. | 芯瑞微（上海）電子科技有限公司 高級工程師 何佳南 Jayden He, Senior Engineer, PhySim Electronic Technology Co., Ltd. |
| 11:40-12:05 | 車規(guī)高集成系統(tǒng)級扇出封裝平臺介紹 Introduction to automotive-grade highly integrated system-level fan-out packaging platform | 矽磐微電子（重慶）有限公司 研發(fā)部總監(jiān) 霍炎 Yan Huo, Director of R&D, SiPLP |
| 12:05-13:30 | 午休及展區(qū)參觀 Lunch Break & SiP Zone | |
| 13:30-13:55 | 集成電路先進(jìn)封裝材料研究與應(yīng)用 Research and Application of Advanced Packaging Materials for Integrated Circuits | 深圳先進(jìn)電子材料國際創(chuàng)新研究院 院長助理 肖彬 Bin Xiao, Dean Assistant, Shenzhen Institute of Advanced Electronic Materials |
| 13:55-14:20 | 晶圓級先進(jìn)封裝的未來趨勢以及微小化對于缺陷檢測的影響 Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection | KLA Corporation 技術(shù)經(jīng)理 裴舜 Eric Pei, Technical Manager, KLA Corporation |
| 14:20-14:45 | SiP的新型焊接及清洗方案 New solution of SIP soldering and cleaning | 歐紛泰化工（上海）有限公司 亞太區(qū)技術(shù)經(jīng)理 龍澤云 Vincent Long, Technical Manager，Asia, INVENTEC Performance Chemicals (Shanghai) Co., Ltd |
| 14:45-15:10 | 華天科技：先進(jìn)封裝驅(qū)動智能世界發(fā)展 HT-tech： Advanced packaging drives the development of intelligent world | 華天科技 TPM經(jīng)理 朱浩 Hao Zhu, TPM Manager, HT-TECH |
| 15:10-15:35 | BGA先進(jìn)封裝全新的植球工藝 BGA advanced package new ball planting process | 廣東鴻騏芯智能裝備有限公司 銷售總監(jiān) 胡清松 Megan Hu, Sales Director, Guangdong D-TEK Intelligent Equipment Co., LTD |
| 主持人：廈門云天半導(dǎo)體科技有限公司 總監(jiān) 李金喜武漢新創(chuàng)元半導(dǎo)體有限公司 副總裁 李志東 Session 4: Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd , Key processes for TGV glass substrates Master of ceremonies: Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd | ||
| 09:30-10:00 | 簽到及入場 Registration and Networking | |
| 10:00-10:25 | 玻璃通孔關(guān)鍵技術(shù)及應(yīng)用 Key technology and application of glass through hole | 三疊紀(jì)（廣東）科技有限公司 電子科技大學(xué)教授 公司創(chuàng)始人＆董事長 張繼華 Jihua Zhang, Professor, University of Electronic Science and Technology of China, Founder & Chairman of the Board of Directors of the company, 3D CHIP |
| 10:25-10:50 | 特種平板玻璃：推動半導(dǎo)體先進(jìn)封裝的關(guān)鍵材料 Specialty flat glass: the key material to promote semiconductor advanced packaging | 肖特集團(tuán) 高級經(jīng)理 新業(yè)務(wù)開發(fā) 張廣軍 Guangjun Zhang, Senior Manager, New Business Development，SCHOTT AG |
| 10:50-11:15 | 探索 TGV（玻璃通孔技術(shù)）以實(shí)現(xiàn) PLP（面板級封裝）的無限可能性 Exploring TGV (Through Glass Vias) to enable Endless possibilities of PLP (Panel Level Packaging) | 泛林半導(dǎo)體 資深商務(wù)開發(fā)總監(jiān) 蘇泳樺 Frank Su, Senior Director of Business Development，Lam Research |
| 11:15-11:40 | 玻璃芯基板：新一代先進(jìn)的封裝技術(shù) Glass Core Substrate: Next Gen Advanced Packaging Technology | 安捷利美維電子（廈門）有限責(zé)任公司 安捷利美維FCBGA總經(jīng)理 湯加苗 Jiamiao Tang, General Manager, Antelimervi FCBGA, AKM Meadville Electronics (Xiamen) Co., Ltd |
| 11:40-12:05 | 先進(jìn)玻璃通孔技術(shù)進(jìn)展、應(yīng)用與挑戰(zhàn) Progress, application and challenges of advanced through glass via technology | 廈門云天半導(dǎo)體科技有限公司 總監(jiān) 李金喜 Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd |
| 12:05-13:30 | 午休及展區(qū)參觀 Lunch Break & SiP Zone | |
| 13:30-13:55 | 高密度玻璃載板-ROS技術(shù) High-density Glass Substrate--ROS technology | 武漢新創(chuàng)元半導(dǎo)體有限公司 副總裁 李志東 Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd |
| 13:55-14:20 | 面板級TGV磁控濺射系統(tǒng) PVD Sputter Tool for Large-Size Panel TGV | 深圳市矩陣多元科技有限公司 董事長兼首席科學(xué)家 張曉軍 Xiaojun Zhang, Chairman&Chief Scientist, Arrayed Materials (China) Co., Ltd |
| 14:20-14:45 | 玻璃通孔電鍍：單片制程平臺 Plating of Through-Glass-Vias：Single Panel Processing Platform | 鑫巨（深圳）半導(dǎo)體科技有限公司 CTO 馬庫思·郎 LANG MARCUS ELMAR, CTO, Simetric Semiconductor Solutions Co., Ltd |
| 14:45-15:10 | 激光玻璃通孔技術(shù)助力TGV產(chǎn)業(yè)化 Laser glass through-hole technology promotes TGV industrialization | 武漢帝爾激光科技股份有限公司 營銷副總裁 李彥斌 Ben Lee, VP, Sales & Marketing, Wuhan DR Laser Technology Co., Ltd |
| 15:10-15:35 | TGV玻璃基板關(guān)鍵檢量測技術(shù) Host TGV glass substrate critical measurement technology | 政應(yīng)(上海)科技有限公司 副總經(jīng)理 施介皓 Jiehao Shi, Deputy General Manager, Zhengying (Shanghai) Technology Co., Ltd |
| 15:35-16:00 | 佛智芯TGV工藝挑戰(zhàn)和解決方案 Fozhixin TGV process challenges and solutions | 廣東佛智芯微電子技術(shù)研究有限公司 首席科學(xué)家 林挺宇 Tingyu Lin, Chief Scientist, Fzxsmc |
