深圳會展中心（福田）
2025年8月26日-28日
2024年11月27日，由博聞創(chuàng)意會展主辦的第八屆中國系統(tǒng)級封裝大會SiP Conference China 2024·蘇州站將在蘇州日航酒店召開。本次大會將圍繞 “AI/大算力應(yīng)用”、“存儲/高速互連應(yīng)用”、“新工藝及材料”三大主題開展；涵蓋來自O(shè)SAT、測試/設(shè)備提供商、材料/IC載板供應(yīng)商、系統(tǒng)制造商和研發(fā)行業(yè)的SiP、異構(gòu)集成技術(shù)和商業(yè)趨勢。
Solidigm首席存儲解決方案架構(gòu)師高偉先生將出席SiP Conference China 2024（第八屆中國系統(tǒng)級封裝大會），并發(fā)表題為《Solidigm CSAL軟件解決方案利用IO整形，cache和數(shù)據(jù)放置能力助力DPU DOCA存儲服務(wù)BeeGFS》的主題演講。
將分享：
CSAL is Cloud Storage Acceleration Layer for BigData and AI. it is open-source user mode FTL, cache and io trace component to accelerate AI inside SPDK(upstreamed). https://dl.acm.org/doi/pdf/10.1145/3627703.3629566.
This session we will introduce new features joint development with NVIDIA DPU team and BeeGFS.
1.CSAL leverage DPU DRAM as write buffer who achieve best latency.
2.QLC is favorable by AI since it saves power and space. It is great combine DPU&QLC for better TCO.
3.CSAL in DPU to bring advaned storage IO shaping, caching and data placement into NVIDIA DPU DOCA storage SW service, we can tune for BeeGFS metadata, data services to achieve best SLA. both BeeGFS and CSAL run in the CNode DPU.
4.demostrate the future design idea together with BeeGFS+CSAL inside DPU, saving CPU while better performance.
5. experiment data sharing and report.
高偉 | Solidigm
首席存儲解決方案架構(gòu)師
Wayne Gao is a Principal Engineer as Storage solution architect and worked on CSAL from PF to Alibaba commercial release. Wayne also takes main developer effort to finish CSAL pmem/DSA and cxl.mem PF from intel to Solidigm. Before joining Intel, Wayne has over 20 years of storage developer experience as previous DellEMC PowerScale Sr Principal software engineer in all flash object storage team and has 4 US patent filings/grants and 1 EuroSys2024 paper published. Wayne also have working experience at Alibaba as P8 engineer and build across network and connections with PRC enterprise storage and cloud storage developers. During spare time, Wayne like to play badminton, swimming, movies, and games.
關(guān)于Solidigm
Solidigm is a provider of NAND flash memory solutions. They provide storage products and solutions for data centers. They give data to visionaries, inventors, entrepreneurs, and students, and the advantages spread throughout communities and society.
關(guān)于SiP China 2024
第八屆中國系統(tǒng)級封裝大會
（SiP Conference China 2024）將繼續(xù)在蘇州召開，為期1天，包含主題演講和技術(shù)報告，主題涵蓋來自O(shè)SAT、測試/設(shè)備提供商、材料/IC載板供應(yīng)商、系統(tǒng)制造商和研發(fā)行業(yè)的SiP、異構(gòu)集成技術(shù)和商業(yè)趨勢。本次大會將采用以行業(yè)應(yīng)用為驅(qū)動的分論壇模式，聚焦于AI、算力、存儲、數(shù)據(jù)中心、汽車電子、物聯(lián)網(wǎng)等關(guān)鍵應(yīng)用領(lǐng)域報告。
中國系統(tǒng)級封裝大會作為中國最重要的SiP會議，在全球SiP與先進封測領(lǐng)域享有廣泛影響力，于2017至2023年期間共吸引了來自中國、美國、法國、德國、意大利、荷蘭、日本、韓國、印度、新加坡、馬來西亞等國家及地區(qū)的250+家企業(yè)參與，每年線下匯聚600~2000+位專業(yè)觀眾，實現(xiàn)了前沿技術(shù)交流，高端圈層的融合。
由博聞創(chuàng)意會展主辦的elexcon2025深圳國際電子展將于2025年8月26-28日在深圳會展中心（福田）舉辦。以 “AII for AI, AIl for GREEN：為AI與雙碳提供全棧技術(shù)與供應(yīng)鏈支持” 為主題。展會將集中展示 AI與算力芯片、存儲、嵌入式AI、電源及能源電子、高性能電子元器件、Chiplet異構(gòu)集成生態(tài)等前沿產(chǎn)品與技術(shù)及解決方案，全面覆蓋人工智能、新能源汽車、工業(yè)自動化、軌道交通、物聯(lián)網(wǎng)等熱門領(lǐng)域，推動技術(shù)創(chuàng)新與產(chǎn)業(yè)發(fā)展。更多展會詳情請登錄m.mf0o.cn 展位、贊助商及演講人申請請聯(lián)系：0755-88311535
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