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曼恩斯特科技亮相elexcon2024深圳國(guó)際電子展
發(fā)布時(shí)間: 2024-09-14
瀏覽次數(shù): 24 次

2024年9月11日，深圳市曼恩斯特科技股份有限公司舉行了以“疊層突破 涂領(lǐng)未來”為主題的百兆瓦級(jí)疊層狹縫涂布系統(tǒng)出貨儀式，曼恩斯特相關(guān)領(lǐng)導(dǎo)及團(tuán)隊(duì)均到場(chǎng)參加，共同見證了這一重要時(shí)刻。

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繼上個(gè)月底曼恩斯特自主研發(fā)的中國(guó)首臺(tái)GW級(jí)狹縫涂布平板系統(tǒng)成功出貨，緊接著在不到兩周的時(shí)間內(nèi)，曼恩斯特在泛半導(dǎo)體領(lǐng)域就再傳捷報(bào)：此次出貨的百兆瓦級(jí)疊層狹縫涂布系統(tǒng)，是目前市面上首款能夠實(shí)現(xiàn)自動(dòng)化晶硅-鈣鈦礦疊層涂布的設(shè)備，標(biāo)志著曼恩斯特在泛半導(dǎo)體領(lǐng)域的綜合技術(shù)實(shí)力邁上了新的臺(tái)階，必將加速晶硅疊層電池的大規(guī)模產(chǎn)業(yè)化進(jìn)程。


作為國(guó)家專精特新“小巨人”企業(yè)，曼恩斯特積極響應(yīng)習(xí)總書記“發(fā)展新質(zhì)生產(chǎn)力”的號(hào)召，未來將繼續(xù)加大研發(fā)投入、不斷突破技術(shù)壁壘，為行業(yè)的高質(zhì)量發(fā)展貢獻(xiàn)自身力量。


On September 11, 2024, Shenzhen Manst Technology Co., Ltd. held a grand ceremony under the theme of "Layering Breakthroughs, Coating the Future" to celebrate the delivery of its megawatt-class multilayer slot die coating system. The event was attended by Manst’s senior leadership and R&D team, who came together to witness this significant milestone.

Following the successful shipment of China's first GW-class slot-die coating flat-panel system independently developed by Manst at the end of last month, the company has made another breakthrough in the pan-semiconductor field in less than two weeks. The latest shipment, a 100 MW-class stacked slot-die coating system, is the first on the market capable of achieving automated crystalline silicon-perovskite tandem layer coating. This milestone marks a significant leap in Manst's comprehensive technical capabilities in the pan-semiconductor sector and is expected to accelerate the large-scale industrialization of crystalline silicon tandem cells.

As a National Specialized and New "Little Giant" Enterprise, Manst actively responds to President Xi Jinping's call to "develop new productive forces." The company will continue to increase investment in research and development, consistently overcoming technical barriers, and contributing to the high-quality growth of the industry.


由博聞創(chuàng)意會(huì)展主辦的elexcon2025深圳國(guó)際電子展將于2025年8月26-28日在深圳會(huì)展中心（福田）舉辦。以 “AII for AI, AIl for GREEN：為AI與雙碳提供全棧技術(shù)與供應(yīng)鏈支持” 為主題。展會(huì)將集中展示 AI與算力芯片、存儲(chǔ)、嵌入式AI、電源及能源電子、高性能電子元器件、Chiplet異構(gòu)集成生態(tài)等前沿產(chǎn)品與技術(shù)及解決方案，全面覆蓋人工智能、新能源汽車、工業(yè)自動(dòng)化、軌道交通、物聯(lián)網(wǎng)等熱門領(lǐng)域，推動(dòng)技術(shù)創(chuàng)新與產(chǎn)業(yè)發(fā)展。更多展會(huì)詳情請(qǐng)登錄m.mf0o.cn 展位、贊助商及演講人申請(qǐng)請(qǐng)聯(lián)系：0755-88311535

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